SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

The invention provides a substrate processing apparatus and a substrate processing method. In the substrate processing apparatus, a position offset between a stage and a stage peripheral member in a non-heated state and a heated state of a processing chamber is reduced. When the stage peripheral mem...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KOBAYASHI TAMIHIRO, TANAKA SUMI
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator KOBAYASHI TAMIHIRO
TANAKA SUMI
description The invention provides a substrate processing apparatus and a substrate processing method. In the substrate processing apparatus, a position offset between a stage and a stage peripheral member in a non-heated state and a heated state of a processing chamber is reduced. When the stage peripheral member is disposed in the processing chamber, the stage peripheral member is fixed with respect to the processing chamber by a first positioning pin disposed at a position close to the reference position. Moreover, a second positioning pin, which is located farther than the first positioning pin when viewed from the reference position, is inserted into a second hole part, and the second hole part is formed in a long hole shape along the moving direction of the second positioning pin. With this configuration, the positional shift of the stage peripheral member when the processing chamber is switched from the non-heating state to the heating state is suppressed to the degree of the movement amount of the first positioni
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN113140481A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN113140481A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN113140481A3</originalsourceid><addsrcrecordid>eNrjZLALDnUKDglyDHFVCAjyd3YNDvb0c1dwDAhwBIqFBis4-rkoYFXi6xri4e_Cw8CalphTnMoLpbkZFN1cQ5w9dFML8uNTiwsSk1PzUkvinf0MDY0NTQxMLAwdjYlRAwCYYCqM</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD</title><source>esp@cenet</source><creator>KOBAYASHI TAMIHIRO ; TANAKA SUMI</creator><creatorcontrib>KOBAYASHI TAMIHIRO ; TANAKA SUMI</creatorcontrib><description>The invention provides a substrate processing apparatus and a substrate processing method. In the substrate processing apparatus, a position offset between a stage and a stage peripheral member in a non-heated state and a heated state of a processing chamber is reduced. When the stage peripheral member is disposed in the processing chamber, the stage peripheral member is fixed with respect to the processing chamber by a first positioning pin disposed at a position close to the reference position. Moreover, a second positioning pin, which is located farther than the first positioning pin when viewed from the reference position, is inserted into a second hole part, and the second hole part is formed in a long hole shape along the moving direction of the second positioning pin. With this configuration, the positional shift of the stage peripheral member when the processing chamber is switched from the non-heating state to the heating state is suppressed to the degree of the movement amount of the first positioni</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210720&amp;DB=EPODOC&amp;CC=CN&amp;NR=113140481A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210720&amp;DB=EPODOC&amp;CC=CN&amp;NR=113140481A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KOBAYASHI TAMIHIRO</creatorcontrib><creatorcontrib>TANAKA SUMI</creatorcontrib><title>SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD</title><description>The invention provides a substrate processing apparatus and a substrate processing method. In the substrate processing apparatus, a position offset between a stage and a stage peripheral member in a non-heated state and a heated state of a processing chamber is reduced. When the stage peripheral member is disposed in the processing chamber, the stage peripheral member is fixed with respect to the processing chamber by a first positioning pin disposed at a position close to the reference position. Moreover, a second positioning pin, which is located farther than the first positioning pin when viewed from the reference position, is inserted into a second hole part, and the second hole part is formed in a long hole shape along the moving direction of the second positioning pin. With this configuration, the positional shift of the stage peripheral member when the processing chamber is switched from the non-heating state to the heating state is suppressed to the degree of the movement amount of the first positioni</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLALDnUKDglyDHFVCAjyd3YNDvb0c1dwDAhwBIqFBis4-rkoYFXi6xri4e_Cw8CalphTnMoLpbkZFN1cQ5w9dFML8uNTiwsSk1PzUkvinf0MDY0NTQxMLAwdjYlRAwCYYCqM</recordid><startdate>20210720</startdate><enddate>20210720</enddate><creator>KOBAYASHI TAMIHIRO</creator><creator>TANAKA SUMI</creator><scope>EVB</scope></search><sort><creationdate>20210720</creationdate><title>SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD</title><author>KOBAYASHI TAMIHIRO ; TANAKA SUMI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN113140481A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KOBAYASHI TAMIHIRO</creatorcontrib><creatorcontrib>TANAKA SUMI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KOBAYASHI TAMIHIRO</au><au>TANAKA SUMI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD</title><date>2021-07-20</date><risdate>2021</risdate><abstract>The invention provides a substrate processing apparatus and a substrate processing method. In the substrate processing apparatus, a position offset between a stage and a stage peripheral member in a non-heated state and a heated state of a processing chamber is reduced. When the stage peripheral member is disposed in the processing chamber, the stage peripheral member is fixed with respect to the processing chamber by a first positioning pin disposed at a position close to the reference position. Moreover, a second positioning pin, which is located farther than the first positioning pin when viewed from the reference position, is inserted into a second hole part, and the second hole part is formed in a long hole shape along the moving direction of the second positioning pin. With this configuration, the positional shift of the stage peripheral member when the processing chamber is switched from the non-heating state to the heating state is suppressed to the degree of the movement amount of the first positioni</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN113140481A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-27T16%3A57%3A16IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KOBAYASHI%20TAMIHIRO&rft.date=2021-07-20&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN113140481A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true