SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

The invention provides a substrate processing apparatus and a substrate processing method. In the substrate processing apparatus, a position offset between a stage and a stage peripheral member in a non-heated state and a heated state of a processing chamber is reduced. When the stage peripheral member is disposed in the processing chamber, the stage peripheral member is fixed with respect to the processing chamber by a first positioning pin disposed at a position close to the reference position. Moreover, a second positioning pin, which is located farther than the first positioning pin when viewed from the reference position, is inserted into a second hole part, and the second hole part is formed in a long hole shape along the moving direction of the second positioning pin. With this configuration, the positional shift of the stage peripheral member when the processing chamber is switched from the non-heating state to the heating state is suppressed to the degree of the movement amount of the first positioni