BONDING APPARATUS INCORPORATING VARIABLE FORCE DISTRIBUTION

A bonding apparatus includes a holding element, holding element actuators, sensors, a controller and bond force adjusting actuators. In use, the holding element holds an electrical component and is moved by the holding element actuators in one or more actuating directions to contact the electrical component with a base member. The sensors measure reaction forces exerted on the holding element in response to contact between the electrical component and the base member. The controller determines bond forces to be exerted on actuating areas of the holding element during a bonding process based on the measured reaction forces, and the bond force adjusting actuators exert these bond forces on the actuating areas of the holding element during the bonding process, so as to adjust a tilt of the electrical component relative to the base member. 键合设备包括固持元件、固持元件致动器、传感器、控制器以及键合力调节致动器。使用时，所述固持元件固持电子元件，并且所述固持元件由所述固持元件致动器沿一个或多个致动方向移动，以使所述电子元件与基底构件相接触。响应于所述电子元件与所述基底构件之间的接触，所述传感器测量施加在所述固持元件上的反作用力。所述控制器根据所测量的反作用力确定在键合过程中要施加在所述