Method for forming semiconductor device

A method of forming a semiconductor device includes: removing a dummy gate from a semiconductor fin; depositing an adhesive layer and a filling metal layer on the semiconductor fin; and simultaneously etching the adhesive layer and the filler metal layer with a wet etching solution, the rate of etch...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIN QUNNENG, JIANG ZI'ANG, LIAN JIANZHOU, CHEN JIEWEI, YE MINGXI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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