Packaging structure and forming method thereof

The embodiment of the invention relates to a packaging structure and a forming method thereof. The package structure includes a first package component including a first conductive pad, and a second package component overlying the first package component. The second package component includes a surface dielectric layer, and a conductive bump protruding below the surface dielectric layer. The first conductive bump includes a first sidewall facing away from a center of the first package component, and a second sidewall facing the center. A solder bump bonds the first conductive pad and the first conductive bump. The solder bump contacts the first sidewall. An underfill is between the first package component and the second package component, and the underfill contacts the second sidewall. 本发明的实施例涉及一种封装结构及其形成方法。该封装结构包括：第一封装部件，包括第一导电焊盘，以及第二封装部件，上覆于第一封装部件。第二封装部件包括表面介电层，以及低于表面介电层突出的导电凸块。第一导电凸块包括背离第一封装部件的中心的第一侧壁，以及面向中心的第二侧壁。焊料凸块将第一导电焊盘与第一导电凸块接合。焊料凸块接触第一侧壁。底部充胶在第一封装部件与第二封装部件之间，并且底部充胶接触第二侧壁。