Power electronic assembly having substrate, bushing and contact pin

The invention relates to a power electronics assembly having a substrate, a bushing and a contact pin, the bushing being arranged on a conductor track of the substrate and a foot section of the bushing being connected to the conductor track in a cohesive and electrically conductive manner, the contact pin being arranged with an insertion section in an inner recess of the bushing, an integrally bonded and electrically conductive welded connection is formed between a pin connection section of the insertion section of the contact pin and an associated sleeve connection section of the sleeve by means of a laser weld. 本发明涉及一种具有基板、套管和接触销的功率电子组件，其具有基板、套管和接触销，其中，套管布置在基板的导体迹线上，并且套管的脚区段以材料锁合且导电的方式与导体迹线连接，其中，接触销以插入区段布置在套管的内部空隙中，并且其中，在接触销的插入区段的销连接区段与套管的配属的套管连接区段之间构成借助激光焊接部构成的材料锁合且导电的焊接连接。