Double-circulation heat dissipation system and control method thereof

The invention discloses a double-circulation heat dissipation system which comprises a chip and a cooling fin. A cavity is formed in the cooling fin and is filled with a liquid heat transfer medium, and the heat absorption face of the cooling fin is attached to one face of the chip. The cooling fin comprises a heat absorbing part and a cooling part, the heat absorbing part is arranged at one side of the chip, and the cooling part is arranged at the other side, opposite to the heat absorbing surface, of the chip. The heat absorbing part and the cooling part are connected through a connecting part, a connecting cavity is formed in the connecting part, and the connecting cavity is communicated with a cavity of the heat absorbing part and a cavity of the cooling part. The invention provides a double-circulation heat dissipation system capable of improving the heat dissipation effect on the chip. 本发明公开了一种双循环散热系统，包括芯片和散热片，散热片内形成空腔，空腔内填充液体传热介质，散热片吸热面与芯片一面贴合。所述散热片包括吸热部和散热部，吸热部设置在芯片一侧，散热部设置在与吸热面相对的芯片另一侧，吸热部与散热部通过连接部连接