Foundational Supports within Integrated Assemblies

The invention relates to foundational supports within integrated assemblies. Some embodiments include an integrated assembly having a base (e.g., a monocrystalline silicon wafer), and having memory cells over the base and along channel-material-pillars. A conductive structure is between the memory c...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CLAMPITT DARWIN A, BARCLAY M. JARED, HOPKINS JOHN D, KING MATTHEW J
Format: Patent
Sprache:chi ; eng
Schlagworte:
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