Epoxy modified organic silica gel as well as preparation method and application thereof

The invention belongs to the field of organosilicone, and particularly relates to epoxy modified organosilicone gel as well as a preparation method and application thereof. The organosilicone gel comprises the following raw materials: hydrogen-containing silicone oil, allyl glycidyl ether, a catalyst and the like. The used raw materials are few in variety, and the preparation method is simple; and no organic solvent needs to be added in the preparation process, and the obtained organic silica gel is non-toxic and harmless. The gel can be cured at normal temperature, no bubbles are generated in the curing process, the gel is colorless and transparent, the adhesive force to a base material is good, the application range is wide, the hardness of part of the cured organic silicon gel is as low as 9shore A, the gel can be used for electronic material pouring sealants, after electronic products go wrong, the gel can be easily disassembled for maintenance, the highest hardness of part of the silica gel after curing