METHOD FOR MANUFACTURING HEAD CHIP AND HEAD CHIP FOR LIQUID EJECTING HEAD

The invention relates to a head chip manufacturing method and a head chip of a liquid ejecting head. The present invention ensures insulation between electrodes and improves resistance to liquid. Forming a conductive film on the surface of the piezoelectric substrate; performing laser processing on the conductive film in the extending direction of the grooves between the first groove and the second groove of the piezoelectric substrate; a laser processing region from which the conductive film has been removed is formed on the surface of the piezoelectric substrate between the first groove and the second groove. In the formation of the laser processing region, laser light is irradiated along a plurality of laser processing lines extending in the groove extension direction. Furthermore, each of the plurality of laser processing lines is irradiated with laser light a plurality of times, and the irradiation of the laser light along the same one of the plurality of laser processing lines is performed with a time i