Grinding control method of chemical mechanical grinding process

The invention discloses a grinding control method of a chemical mechanical grinding process. An iAPC is adopted for grinding control, and control parameters of the iAPC comprise a simulated grinding rate and the service time of consumables. The grinding control method comprises the steps that a firs...

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Bibliographische Detailangaben
Hauptverfasser: XIA HUIZHE, LI SONG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a grinding control method of a chemical mechanical grinding process. An iAPC is adopted for grinding control, and control parameters of the iAPC comprise a simulated grinding rate and the service time of consumables. The grinding control method comprises the steps that a first specific gravity value of the simulated grinding rate is reduced; the fixed grinding rate is increased, and a second specific gravity value of the fixed grinding rate is set to be one minus the first specific gravity value; and the simulated grinding rate and the fixed grinding rate are combined to form a grinding rate feedback value. The simulated grinding rate is obtained by simulating chemical mechanical grinding equipment, the simulated grinding rate is influenced by random factors, and the influence of the random factors on the grinding rate feedback value is reduced by reducing the proportion of the simulated grinding quantity. According to the grinding control method of the chemical mechanical grinding pro