Semiconductor packaging antimagnetic structure

A semiconductor packaging antimagnetic structure is characterized in that the semiconductor packaging antimagnetic structure comprises a substrate, a first chip, a first wire, an adhesive layer, a second chip, a metal film and a second wire; the substrate is provided with an upper surface, a lower s...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	JIANG YINGHONG, LIN YUNENG, CHEN ZHENGHONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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