Semiconductor packaging antimagnetic structure

A semiconductor packaging antimagnetic structure is characterized in that the semiconductor packaging antimagnetic structure comprises a substrate, a first chip, a first wire, an adhesive layer, a second chip, a metal film and a second wire; the substrate is provided with an upper surface, a lower surface and a plurality of electric connection structures penetrating through the upper surface and the lower surface, and a window is arranged between the upper surface and the lower surface. The first chip is provided with an active surface and a back surface, the active surface is downwards arranged on the upper surface of the substrate, a part of the active surface of the first chip is exposed in the window, and the part of the active surface exposed in the window is electrically connected with the electric connection structure of the substrate; meanwhile, the first wire electrically connects the active surface with the lower surface of the substrate through the part exposed out of the window. Then, an adhesive