Nano directional heat-conducting adhesive film capable of being used for electronic component packaging and preparation method thereof

The invention discloses a nano directional heat-conducting adhesive film capable of being used for electronic component packaging and a preparation method thereof, wherein the nano directional heat-conducting adhesive film comprises the following components in parts by weight: a base film raw material, peroxide, a nano heat-conducting microcapsule, a cross-linking monomer and a silane coupling agent. The invention relates to a nano heat-conducting adhesive film prepared from nano heat-conducting microcapsules, amino-functionalized graphene oxide and magnetic graphene, and relates to the technical field of heat dissipation of electrical elements. According to the nano directional heat-conducting adhesive film capable of being used for electronic component packaging and the preparation method thereof, the nano particles with good heat conductivity are dispersed into a base film, and a graphene array is combined with the nano heat-conducting film, so that the heat conduction efficiency is improved, and meanwhile