Semiconductor wafer processing method and cleaning brush head

The embodiment of the invention provides a semiconductor wafer processing method and a cleaning brush head. The method includes the following steps: performing a cleaning process on a support surface of a wafer seat using a cleaning brush head having a plurality of microstructures, wherein the microstructures are spaced apart from each other by a distance and have a gradually reduced width; placing a semiconductor wafer on the support surface of the wafer seat; and performing a lithography process on the semiconductor wafer. 本揭露部分实施例提供一种半导体晶圆加工方法及清洁刷头。上述方法包括利用具有多个微结构的一清洁刷头对一晶圆座的一支撑表面进行一清洁制程。微结构间彼此相隔一间距且具有渐缩的宽度。上述方法还包括放置一半导体晶圆于晶圆座的支撑表面。上述方法还包括对半导体晶圆进行微影制程。