POLYIMIDE-BASED FILM, POLYIMIDE-BASED COMPOSITION, AND FILM MANUFACTURING METHOD USING SAME

Provided are: a polyimide-based film having a small high-temperature hysteresis gap; a polyimide-based composition capable of forming same; and a film manufacturing method using same. The polyimide-based film, for a thickness of 10 [mu]m thereof, has a yellow index of 15 or lower, a glass transition...

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Bibliographische Detailangaben
Hauptverfasser:	YOUN HYOC-MIN, AN MINSHI, KIM DONG-MIN, KIM BYUNG-UK, PARK SE-JOO, CHO YOUNG-WOON, JUNG JAE-HOON, CHO TAE-PYO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	Provided are: a polyimide-based film having a small high-temperature hysteresis gap; a polyimide-based composition capable of forming same; and a film manufacturing method using same. The polyimide-based film, for a thickness of 10 [mu]m thereof, has a yellow index of 15 or lower, a glass transition temperature of 350 DEG C or higher, a coefficient of thermal expansion of 30 ppm/DEG C or less, and a high-temperature hysteresis gap of 80 [mu]m or less in the temperature range of 50-350 DEG C. 提供一种高温尺寸变化较小的聚酰亚胺类薄膜、可以形成上述聚酰亚胺薄膜的聚酰亚胺类组合物、以及利用上述聚酰亚胺类组合物的薄膜制造方法。聚酰亚胺薄膜以厚度10μm为基准，其黄色指数为15以下，玻璃化转变温度为350℃以上，热膨胀系数为30ppm/℃以下，在50至350℃温度范围内的高温尺寸变化(Hysteresis Gap)为80μm以下。