LED underfill process

The invention provides an LED underfill process. The LED underfill process comprises a laminating step, a glue injection step, a vacuumizing step and a fixing step. In the laminating step, a light-emitting surface of an LED module is arranged upwards, then the LED module is placed in a fixing tool, and the LED module is laminated in the fixing tool by using a laminating tool; in the glue injection step, glue is injected into a gap between the laminating tool and the fixing tool; in the vacuumizing step, the middle of the LED module is vacuumized so as to enable glue to flow into a cavity between the light-emitting surface of the LED module and the laminating tool from the gap, and the glue is attached to the light-emitting surface of the LED module; and in the fixing step, vacuumizing is stopped, and the glue is fixed on the light-emitting surface after the glue is cured to finish filling. The LED module solves the problem that the consistency of the bottom color of the LED module is poor in the prior art. 本发