Chip mounting device
The invention provides a chip mounting device which comprises a substrate feeding device, a substrate conveying device, a chip conveying device, a chip positioning device, an alignment welding device, a positioning device and a discharging device; the output end of the substrate feeding device is co...
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| Hauptverfasser: | , , , |
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| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
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| Zusammenfassung: | The invention provides a chip mounting device which comprises a substrate feeding device, a substrate conveying device, a chip conveying device, a chip positioning device, an alignment welding device, a positioning device and a discharging device; the output end of the substrate feeding device is connected with the substrate input end of the alignment welding device through the substrate conveying device; the output end of the chip positioning device is connected with the chip input end of the alignment welding device through the chip conveying device; the output end of the alignment welding device is connected with the input end of the discharging device through the substrate conveying device; and the positioning device is electrically connected with the chip conveying device, the chip positioning device and the alignment welding device. The chip mounting device further comprises an electrical system; the electrical system is electrically connected with the substrate feeding device, the substrate conveying d |
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