SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

The invention provides a substrate processing apparatus and a substrate processing method, which can polish the entire substrate in a radial direction of the substrate while suppressing the occurrence of scratches on the substrate. A substrate processing apparatus includes: a holding part for holdin...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	MIYAHARA OSAMU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	The invention provides a substrate processing apparatus and a substrate processing method, which can polish the entire substrate in a radial direction of the substrate while suppressing the occurrence of scratches on the substrate. A substrate processing apparatus includes: a holding part for holding a substrate; a rotating part for rotating the holding part to rotate the substrate together with the holding part; a liquid supply part for supplying a cleaning liquid to a main surface of the substrate; a polishing head for polishing the main surface of the substrate; a moving part for scanning the polishing head in a radial direction of the substrate while pressing the polishing head against the main surface of the substrate; and a controller for controlling the rotating part, the liquid supply part, and the moving part. The controller sets a division line that divides the main surface of the substrate into plural areas in the radial direction, and controls the liquid supply part to supply the cleaning liquid f