BUBBLE DEFECT REDUCTION

In some examples, a method of processing a substrate comprises applying a photoresist (PR) onto a surface of the substrate, pre-exposing the PR to ultra violet (UV) light before depositing or etching a metal oxide (MO) layer onto the PR, and depositing or etching a MO layer onto the PR subsequent to...

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Bibliographische Detailangaben
Hauptverfasser:	KANAKASABAPATHY SIVA KRISHNAN, SINGHAL AKHIL N, VAN SCHRAVENDIJK BART JAN, SMITH DAVID C, DIXIT GIRISH A
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	In some examples, a method of processing a substrate comprises applying a photoresist (PR) onto a surface of the substrate, pre-exposing the PR to ultra violet (UV) light before depositing or etching a metal oxide (MO) layer onto the PR, and depositing or etching a MO layer onto the PR subsequent to pre-exposing the PR to UV light. 在一些示例中，一种处理衬底的方法包括：在衬底的表面上施加光致抗蚀剂(PR)，在PR上沉积或蚀刻金属氧化物(MO)层之前，将PR预先暴露于紫外线(UV)光，然后在将PR预先暴露于UV光之后，在PR上沉积或蚀刻MO层。