Power module
The invention discloses a power module. The power module comprises a power assembly, a connecting plate body and a packaging body, wherein the power assembly comprises a heat conduction substrate and a plurality of insulated gate bipolar transistor assemblies. The plurality of insulated gate bipolar...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The invention discloses a power module. The power module comprises a power assembly, a connecting plate body and a packaging body, wherein the power assembly comprises a heat conduction substrate and a plurality of insulated gate bipolar transistor assemblies. The plurality of insulated gate bipolar transistor assemblies are arranged on the plurality of first electric connection parts of the heat conduction substrate, and the plurality of second electric connection parts of the heat conduction substrate are arranged around the plurality of first electric connection parts. The connecting plate body is provided with a through hole, a plurality of third electric connecting parts and a plurality of fourth electric connecting parts are respectively formed on two side surfaces of the connecting plate body, and the plurality of third electric connecting parts and the plurality of fourth electric connecting parts are connected with each other. The connecting plate body is fixed on one side of the heat conduction subs |
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