LED module surface consistency treatment process
The invention provides an LED module surface consistency treatment process. The LED module surface consistency treatment process comprises the steps of a cutting step, wherein a colored film is cut into a shape which is matched with the appearance of an LED module and is larger than the LED module;...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides an LED module surface consistency treatment process. The LED module surface consistency treatment process comprises the steps of a cutting step, wherein a colored film is cut into a shape which is matched with the appearance of an LED module and is larger than the LED module; a film pressing step, wherein the film is pressed onto the light-emitting surface of the LED module; and a trimming step, wherein the part, exceeding the peripheral edge of the LED module, of the film is bent and is attached to the side edge and the back surface of the LED module. The LED module surface consistency treatment process solves the problem that in the prior art, the consistency of the bottom color of the LED module is poor.
本发明提供了一种LED模块表面一致性的处理工艺。LED模块表面一致性的处理工艺包括:裁剪步骤:将具有颜色的膜片裁剪为与LED模块的外形相适配且大于LED模块的形状;压膜步骤:将膜片压贴在LED模块的发光面上;修整步骤:将超出LED模块的四周边沿的膜片弯折并与LED模块的侧边和背面贴合。本发明解决了现有技术中LED模块底色的一致性差的问题。 |
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