COPOLYESTER RESIN, MOLDED PRODUCT, AND HEAT-SHRINKABLE FILM

The present invention relates to a copolyester resin to solve the problem in which the contamination of a die or the attachment of foreign matter to a film or a molded product occurs when continuously producing the film or the molded product, wherein when a main component of dicarboxylic acid compon...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SASAKI HIRONAO, UOTANI KOSUKE, NAKAGAWA SATORU, OHASHI HIDETO, TOGAWA KEIICHIRO, HIRONAKA NOBUYUKI
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The present invention relates to a copolyester resin to solve the problem in which the contamination of a die or the attachment of foreign matter to a film or a molded product occurs when continuously producing the film or the molded product, wherein when a main component of dicarboxylic acid components is terephthalic acid, a main component of diol components is ethylene glycol, and the total content of the diol components is 100 mol%, the content of neopentylglycol is greater than 15 mol% and equal to or less than 40 mol%, the content of diethylene glycol is 6-20 mol%, the content of a cyclic dimer composed of terephthalic acid, neopentylglycol and diethylene glycol is at most 5000 ppm, and the content of a cyclic trimer composed of terephthalic acic and ethylene glycol is at most 5000 ppm. 本发明的共聚聚酯树脂解决了在连续地生产膜和成型品时发生塑膜挤压模污染、在膜和成型品上异物附着的问题,该共聚聚酯树脂中,在二羧酸成分的主要成分为对苯二甲酸、二醇成分的主要成分为乙二醇并将全部的二醇成分设为100mol%时,新戊二醇的含量为大于15mol%且40mol%以下,二乙二醇的含量为6~20mol%,由对苯二甲酸、新戊二醇和二乙二醇构成的环状二聚体的含量为5000ppm以下,以及由对苯二甲酸和乙二醇构成的环状三聚体的含量为5000p