Chip-on-film packaging structure and manufacturing method thereof

The invention provides a chip-on-film packaging structure and a manufacturing method thereof. The chip-on-film packaging structure comprises a flexible circuit substrate, a chip, a plurality of bumps, a passivation metal layer and a packaging colloid. The flexible circuit substrate includes a flexible base material, a plurality of leads and a solder resist layer. The leads are arranged on the flexible base material, extend outwards from the chip setting area and are adjacently arranged. Each lead comprises an inner pin located in the chip setting area. The solder resist layer exposes the chip setting area and the inner lead. The chip is electrically connected with the flexible circuit substrate through bonding the bumps and the inner leads correspondingly. The passivation metal layer covers the exposed surfaces of the inner leads and the bumps. The packaging colloid covers the passivation metal layer, the inner leads and the bumps. 本发明提供一种薄膜覆晶封装结构和其制作方法。薄膜覆晶封装结构，包括可挠性线路基板、芯片、多个凸块、钝化金属层与封装胶体。可挠性线路基板包括可挠性基材、多个引