Integrated circuit manufacturing process

The invention discloses an integrated circuit manufacturing process. The manufacturing process comprises the following steps: a, sputtering; b, photoresist coating; c, exposing; d, developing; e, electrogilding; and f, post-treatment, wherein a sputtering machine in the step a comprises a main body, an air exhauster, a feeding hole, a discharging hole, a cooling cavity, a feeding bin, a feeding device, a sealing door and a workbench; and the feeding device comprises a moving table, a push plate, a motor, an air suction bin, a driving roller, a driving torsion spring, a driving rope, an air suction mechanism, a feeding plate, a clamping groove and a feeding mechanism. The air suction mechanism is started while products are fed through the push plate so that the feeding bin starts to enter a vacuum state; a vacuum feeding effect is achieved, the interior of the main body can be in a vacuum state all the time, and a condition that air exhausting is needed during feeding every time is avoided; the sputtering effi