Polyimide film electrolytic copper plating equipment and using method thereof

The invention discloses polyimide film electrolytic copper plating equipment and a using method thereof, and relates to the technical field of electrolytic copper plating equipment. The polyimide film electrolytic copper plating equipment and the using method thereof aim to solve the problems that i...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HU QIAOCHEN, JUAN PEIJUN, YANG SHUNTAO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY CLEANING CLEANING IN GENERAL ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TRANSPORTING
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