Polyimide film electrolytic copper plating equipment and using method thereof

The invention discloses polyimide film electrolytic copper plating equipment and a using method thereof, and relates to the technical field of electrolytic copper plating equipment. The polyimide film electrolytic copper plating equipment and the using method thereof aim to solve the problems that in the workpiece electrolytic copper plating process, operation is tedious, and the labor intensity of workers is high. The polyimide film electrolytic copper plating equipment comprises an electroplating support, wherein an electric guide rail is fixedly connected to the outer wall of the bottom end of the electroplating support through screws, and an electroplating box body and a cleaning box body are connected to the outer wall of the top end of the electric guide rail in a sliding mode. The using method of the polyimide film electrolytic copper plating equipment comprises the following step: installing an electroplating workpiece and an insoluble anode bar on a cathode electric push rod and an anode electric pus