Film forming method and film forming apparatus

The present invention provides a film forming method and a film forming apparatus capable of suppressing the generation of voids when forming a thin film on the surface of a substrate on which a convex portion and a concave portion are formed. The film forming method forms a film on a substrate (10) in which convex portions extending in a first direction and concave portions extending in the first direction are alternately formed in a second direction intersecting the first direction. The film forming method comprises a step for forming a thin film while conveying the substrate (10) in the second direction; a first etching step of etching the substrate (10) by irradiating the substrate (10) with a first etching beam while conveying the substrate (10) on which the thin film is formed in the second direction; and a second etching step of etching by irradiating the substrate (10) with a second etching beam from an irradiation direction different from that of the first etching beam while conveying the substrate (