Machining method of G5 integrated aluminum target material

The invention provides a machining method of a G5 integrated aluminum target material, which comprises the steps of finish milling of a welding surface, rough milling of an appearance, semi-finish milling of a sputtering surface, finish milling of the sputtering surface, finish milling of the appear...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: PAN JIE, YAO LIJUN, WANG XUEZE, BIAN YIJUN, HAN ZHEDONG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides a machining method of a G5 integrated aluminum target material, which comprises the steps of finish milling of a welding surface, rough milling of an appearance, semi-finish milling of a sputtering surface, finish milling of the sputtering surface, finish milling of the appearance and finish milling of an R angle which are performed in sequence; and by reasonably arranging a machining sequence, selecting a self-made cutter, and setting reasonable machining parameters and a cooling mode, the flatness, the parallelism and the product surface roughness of the G5 integrated aluminum target material obtained through machining can meet the requirements of semiconductor products. 本发明提供了一种G5一体铝靶材的加工方法,所述加工方法包括依次进行的精铣焊接面、粗铣外形、半精铣溅射面、精铣溅射面、精铣外形以及精铣R角,通过合理安排加工顺序、选择自制刀具、设置合理加工参数、冷却方式,可以使得加工得到的G5一体铝靶材在平面度、平行度以及产品表面粗糙度均可以达到半导体产品的要求。