ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Provided are an electronic device package and a method for manufacturing the same. The electronic device package includes a substrate, a first semiconductor die, a second semiconductor die and an encapsulant. The substrate includes a first surface, and a second surface opposite to the first surface. The substrate defines a cavity recessed from the first surface. The first semiconductor die is disposed in the cavity. The second semiconductor die is disposed over and electrically connected to the first semiconductor die. The encapsulant is disposed in the cavity of the substrate. The encapsulant encapsulates a first sidewall of the first semiconductor die, and exposes a second sidewall of the first semiconductor die. 一种电子装置封装和其制造方法。电子装置封装包含衬底、第一半导体裸片、第二半导体裸片以及囊封物。所述衬底包含第一表面以及与所述第一表面相对的第二表面。所述衬底限定从所述第一表面凹陷的腔室。所述第一半导体裸片安置在所述腔室中。所述第二半导体裸片安置在所述第一半导体裸片上方并且电连接到所述第一半导体裸片。所述囊封物安置在所述衬底的所述腔室中。所述囊封物囊封所述第一半导体裸片的第一侧壁，并且暴露所述第一半导体裸片的第二侧壁。