Wafer-level fan-out type packaging method capable of eliminating chip displacement difference

The invention discloses a wafer-level fan-out packaging method capable of eliminating the chip displacement difference. The method comprises the steps: firstly, calculating the offset of a chip after plastic packaging corresponding to the material of a temporary slide, the material of a plastic pack...

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Bibliographische Detailangaben

Hauptverfasser:	WANG XIN, JIANG ZHENLEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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