Wafer-level fan-out type packaging method capable of eliminating chip displacement difference

The invention discloses a wafer-level fan-out packaging method capable of eliminating the chip displacement difference. The method comprises the steps: firstly, calculating the offset of a chip after plastic packaging corresponding to the material of a temporary slide, the material of a plastic packaging layer, the plastic packaging temperature and the room temperature, shifting the chip in a direction opposite to a possible offset direction by enough distance in advance, mounting the chip on a temporary slide glass, carrying out plastic package on the temporary slide glass on which the chip is mounted, then removing the temporary slide glass, preparing a rewiring layer on the side surface of a plastic package layer, which is exposed out of a chip pin, through integral exposure, and finally, reballing on the rewiring layer and cutting the rewiring layer into small packaging bodies. Through the design scheme of the invention, the displacement difference generated in the plastic packaging process of the chip ca