RFID PART AUTHENTICATION AND TRACKING OF PROCESSING COMPONENTS

Embodiments provided herein provide for methods and apparatus for detecting, authenticating, and tracking processing components including consumable components or non-consumable components used on substrate processing systems for electronic device manufacturing, such as semiconductor chip manufactur...

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Bibliographische Detailangaben
Hauptverfasser:	PURI AMITABH, HUNTER EARL, REEDY STEVEN M, DUKE RUSSELL
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING CONTROL OR REGULATING SYSTEMS IN GENERAL CONTROLLING COUNTING DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS FUNCTIONAL ELEMENTS OF SUCH SYSTEMS GRINDING HANDLING RECORD CARRIERS MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS PERFORMING OPERATIONS PHYSICS POLISHING PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS REGULATING SEMICONDUCTOR DEVICES TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHICCOMMUNICATION TRANSPORTING WIRELESS COMMUNICATIONS NETWORKS
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Beschreibung
Zusammenfassung:	Embodiments provided herein provide for methods and apparatus for detecting, authenticating, and tracking processing components including consumable components or non-consumable components used on substrate processing systems for electronic device manufacturing, such as semiconductor chip manufacturing. The semiconductor processing systems and/or its processing components herein include a remote communication device, such as a wireless communication apparatus, for example radio frequency identification (RFID) devices or other devices embedded in, disposed in, disposed on, located on, or otherwise coupled to one or more processing components or processing component assemblies and/or integrated within the semiconductor processing system itself. The processing component may include a single component (part) or an assembly of components (parts) that are used within the semiconductor processing tool. 本案提供的实施方式提供用于检测、认证、及追踪处理部件的方法及装置，处理部件包括用在电子器件制造(诸如半导体芯片制造)的基板处理系统上的可消耗部件或非可消耗部件。本案中的半导体处理系统及/或半导体处理系统的处理部件包括远程通信器件(