Black aluminum oxide ceramic for semiconductor integrated circuit packaging, preparation method thereof and green tape

The invention provides black aluminum oxide ceramic for semiconductor integrated circuit packaging. The black aluminum oxide ceramic comprises a ceramic raw material, an organic solvent, an adhesive, a plasticizer and an additive, wherein the ceramic raw materials comprise the following materials in parts by weight: 100-120 parts of aluminum oxide, 0.2-3 parts of calcium carbonate, 0.5-5 parts of clay, 0.2-3 parts of talcum powder, 0.1-1 part of chromium sesquioxide and 0.3-3 parts of titanium dioxide, and a good light-shielding property is achieved. The invention also provides a preparation method of the black aluminum oxide ceramic for semiconductor integrated circuit packaging. The slurry of the black aluminum oxide ceramic for semiconductor integrated circuitpackagingis subjected to ball milling. The invention also provides a green tape for semiconductor integrated circuit packaging. The green tape is obtained by casting the ceramic slurry prepared by the preparation method of the black alumina ceramic fo