SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SCREEN

In the present invention, a printed circuit board has in-pad vias. In a first step, a first component group 40 is mounted on a first surface S1 of a printed circuit board 10B. A screen 50B to be used in a second step has openings at positions corresponding to a plurality of pads 14 on a second surface S2, and has a recess 56 at a position overlapping in-pad vias 17. Solder paste 60 is applied from above the screen 50B, and the screen 50B is removed. Then, a second component group 70 is mounted on the second surface S2. 在本发明中，印刷电路板具有焊盘内通孔。在第一步骤中，将第一部件组40安装在印刷电路板10B的第一表面S1上。在第二步骤中使用的丝网50B在对应于第二表面S2上的多个焊盘14的位置处具有开口，并且具有定位在与焊盘内通孔17重叠的位置处的凹部56。焊膏60从丝网50B上方施加，并且丝网50B被移除。然后，将第二部件组70安装在第二表面S2上。