Flexible epoxy resin adhesive and application thereof
The invention discloses a flexible epoxy resin adhesive and application thereof, and belongs to the technical field of high polymer materials. The flexible epoxy resin adhesive comprises a component A and a component B in a mass ratio of 2: (0.8-1.2), the component A is prepared from the following c...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a flexible epoxy resin adhesive and application thereof, and belongs to the technical field of high polymer materials. The flexible epoxy resin adhesive comprises a component A and a component B in a mass ratio of 2: (0.8-1.2), the component A is prepared from the following components in parts by mass: 90 to 100 parts of bisphenol A type epoxy resin, 30 to 40 parts of polyurethane, 40 to 55 parts of vinyl ester resin, 10 to 20 parts of an unsaturated epoxy compound, 15 to 25 parts of a diluting solvent, 1 to 3 parts of a silane coupling agent, 0.2 to 0.4 part of a polymerization inhibitor, 1 to 4 parts of an accelerant and 0.2 to 0.4 part of a defoaming agent; and the component B is prepared from the following components in parts by mass: 85 to 100 parts of a modified curing agent, 5 to 10 parts of an initiator, 0.1 to 0.5 part of a wetting agent, 0.1 to 0.4 part of a flatting agent and 0.1 to 0.4 part of a mildew preventive. The adhesive is stable in chemical performance, non-toxic an |
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