HEAT SPREADER FOR SEMICONDUCTOR DEVICE MODULES

The invention relates to a heat spreader for semiconductor device modules. A heat spreader configured for use with a dual-in line memory module (DIMM) is provided. The heat spreader comprises a thermally conductive body having upper and lower edges with a first length, opposing side edges with a second length less than the first length, and a planar surface configured for attachment to a plurality of co-planar semiconductor devices of the DIMM, and a retaining clip configured to releasably attach the thermally conductive body to the DIMM when disposed within a side notch of the DIMM and around a first one of the opposing side edges of the thermally conductive body. 本申请案涉及用于半导体装置模块的散热器。本发明提供一种经配置以与双列直插式存储器模块DIMM搭配使用的散热器。所述散热器包括：热传导主体，其具有具第一长度的上边缘及下边缘、具小于所述第一长度的第二长度的相对侧边缘及经配置以附接到所述DIMM的多个共面半导体装置的平坦表面；及保持夹，其经配置以在安置在所述DIMM的侧凹槽内及所述热传导主体的所述相对侧边缘中的第一侧边缘周围时将所述热传导主体可释放地附接到所述DIMM。