Wafer horizontal electroplating device and jet flow method of cathode electroplating liquid

The invention provides a wafer horizontal electroplating device and a jet flow method of cathode electroplating liquid. The wafer horizontal electroplating device comprises a wafer carrier, an electroplating liquid pool and at least one group of cathode electroplating liquid spray head combinations, the electroplating liquid pool comprises an anode electroplating liquid pool body and a cathode electroplating liquid pool body, an ionic membrane is arranged between the cathode electroplate liquid pool body and the anode electroplate liquid pool body, and each group of cathode electroplate liquid spray head combinations comprise two oppositely arranged cathode electroplate liquid spray heads. Fluid parallel to the surface of a wafer is generated through the cathode electroplating liquid spray heads, so that bubbles accumulated in a to-be-electroplated structural layer of the wafer are discharged along the fluid, and electroplating holes are prevented from being generated; During electroplating, the two oppositel