Spraying module and cleaning agent recovery system
The invention provides a spraying module and a cleaning agent recovery system. On one hand, the spraying module comprises a first input pipeline for inputting a first cleaning agent; the first input pipeline communicates with a return pipeline; and the first cleaning agent is input into the return p...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a spraying module and a cleaning agent recovery system. On one hand, the spraying module comprises a first input pipeline for inputting a first cleaning agent; the first input pipeline communicates with a return pipeline; and the first cleaning agent is input into the return pipeline to be recovered before sprayed. On the other hand, a recovery component and a recovery treatment module which are located in a cavity of the cleaning module extracts the first cleaning agent for recovering after the sprayed waste liquid is treated. The cleaning agent is recovered before spraying, and the waste liquid after wafer cleaning is recovered after treatment, so that the recovery rate of the cleaning agent is effectively increased, and the production cost is reduced.
本发明提供一种喷射模组和清洗剂回收系统,一方面,喷射模组包括输入第一清洗剂的第一输入管道;所述第一输入管道连通一回程管道;将所述第一清洗剂输入所述回程管道在喷射前进行回收。另一方面,位于所述清洗模组的腔体内的回收构件、回收处理模组将喷射后的废液处理后提取第一清洗剂进行回收。通过在喷射前进行清洗剂的回收以及清洗晶圆后的废液进行处理后进行回收,有效的提高了清洗剂的回收率,降低生产成本。 |
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