SEMICONDUCTOR PACKAGE INCLUDING NONCONDUCTIVE FILM HAVING CONTROLLED TAIL PORTION

The invention provides a semiconductor package including a nonconductive film having a controlled tail portion. The semiconductor package according to an aspect includes a package substrate, a first semiconductor chip disposed on the package substrate and including a first through electrode, a second semiconductor chip stacked on the first semiconductor chip and having a second through electrode, and a nonconductive film disposed in a bonding zone between the first semiconductor chip and the second semiconductor chip. At an edge portion of the bonding zone, an edge portion of the first semiconductor chip is recessed in the lateral direction, based on an edge portion of the second semiconductor chip. 包括具有可控尾部的非导电膜的半导体封装。根据一方面的半导体封装包括：封装基板；第一半导体芯片，其设置在封装基板上并且包括第一贯通电极；第二半导体芯片，其层叠在第一半导体芯片上并且具有第二贯通电极；以及非导电膜，其设置在第一半导体芯片和第二半导体芯片之间的接合区中。在接合区的边缘部分处，第一半导体芯片的边缘部分基于第二半导体芯片的边缘部分在横向方向上凹陷。