SOLID-STATE IMAGING DEVICE, METHOD FOR PRODUCING SOLID-STATE IMAGING DEVICE, AND ELECTRONIC DEVICE

The present invention provides a solid-state imaging device which is capable of achieving further improved reliability, while being further suppressed in the production cost. The present invention provides a solid-state imaging device in which a second semiconductor substrate that is provided with a photoelectric conversion part and a second element, a second insulating layer, a first semiconductor substrate that is provided with a first element, and a first insulating layer are sequentially arranged in this order from the light incidence side. This solid-state imaging device is configured such that: the first semiconductor substrate is provided with a groove-like part; the groove-like part has a first side wall and a second side wall; and a part of at least one of the first side wall and the second side wall extends in a direction that is oblique to the light incidence-side surface of the first semiconductor substrate. 本发明提供了一种能够进一步提高可靠性并且进一步降低制造成本的固态摄像装置。本发明提供了一种固态摄像装置，其中，从光入射侧开始依次布置有：设置有光电转换单元和第二元件的第二半导体基板