Power module and manufacturing method thereof
The invention provides a power module and a manufacturing method thereof. The power module comprises a substrate, an electronic assembly, a magnetic assembly and a plastic package part. The substrate comprises a first surface, a second surface and an operation area, the first surface is opposite to...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a power module and a manufacturing method thereof. The power module comprises a substrate, an electronic assembly, a magnetic assembly and a plastic package part. The substrate comprises a first surface, a second surface and an operation area, the first surface is opposite to the second surface, and the operation area is arranged on the first surface or the second surface. The electronic assembly is arranged on the substrate; the magnetic assembly is arranged in the operation area of the substrate and is provided with a side periphery; the plastic package part is arranged on the substrate and wraps the electronic assembly, at least part of the plastic package part surrounds the side periphery of the magnetic assembly, the projection of the plastic package part and the projection of the operation area on the first face of the substrate do not coincide, and a gap is formed between the plastic package part and the side periphery of the magnetic assembly.
本发明提供一种功率模块及其制造方法。功率模块包括基板、电子组件、磁性组 |
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