Printed circuit board and method for detecting interlayer position offset of printed circuit board

The embodiment of the invention relates to a printed circuit board and a method for detecting interlayer position deviation of the printed circuit board. According to one embodiment of the invention, the printed circuit board comprises a core layer, a first metal layer, a second metal layer, a third...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LU WEI, LIN JIADE, TANG MINGRU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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