Printed circuit board and method for detecting interlayer position offset of printed circuit board

The embodiment of the invention relates to a printed circuit board and a method for detecting interlayer position deviation of the printed circuit board. According to one embodiment of the invention, the printed circuit board comprises a core layer, a first metal layer, a second metal layer, a third metal layer and a fourth metal layer. The first metal layer has a first pattern mark, and the second metal layer has a second pattern mark. The first pattern mark and the second pattern mark form a layer deviation detection area, and the distance between the first pattern mark and the second pattern mark in the projection plane of the first surface along the length direction of the printed circuit board is equal to the difference between a first preset deviation value and the erosion amount of the first metal layer and the second metal layer; the first preset deviation value is a first value which allows interlayer deviation to occur between the first metal layer and the second metal layer. According to the method