PCB differential via hole arrangement optimization method

The invention discloses a PCB differential via hole arrangement optimization method, comprising the following steps: presetting a differential via hole radius, a differential via hole pitch and an anti-pad radius, and carrying out physical modeling to obtain a triangular via hole arrangement model;...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ZHANG MUSHUI, LIU GUANGFU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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