PCB differential via hole arrangement optimization method
The invention discloses a PCB differential via hole arrangement optimization method, comprising the following steps: presetting a differential via hole radius, a differential via hole pitch and an anti-pad radius, and carrying out physical modeling to obtain a triangular via hole arrangement model;...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a PCB differential via hole arrangement optimization method, comprising the following steps: presetting a differential via hole radius, a differential via hole pitch and an anti-pad radius, and carrying out physical modeling to obtain a triangular via hole arrangement model; based on the triangular via hole arrangement model, constructing a first pair of differential via holes, a second pair of differential via holes, a third pair of differential via holes and a fourth pair of differential via holes according to a preset rule; and forming a prismatic structure by the first pair of differential via holes, the second pair of differential via holes, the third pair of differential via holes and the fourth pair of differential via holes, and expanding the prismatic structure to obtain a complete differential via hole arrangement structure. According to the method, differential crosstalk is effectively suppressed, the signal integrity is improved, and the signal-to-ground ratio of a differen |
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