ELECTRONIC DEVICE, AND CORRESPONDING MOUNTING PROCESS

The embodiment of the disclosure relates to an electronic device, and a corresponding mounting process. A carrier substrate is configured to carry at least one electronic chip and includes a mounting front face. An encapsulating cover is mounted on the front face of the carrier substrate through a m...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SAXOD KARINE, MASTROMAURO NICOLAS
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ANALOGOUS ARRANGEMENTS USING OTHER WAVES BASIC ELECTRIC ELEMENTS DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION ORRERADIATION OF RADIO WAVES MEASURING PHYSICS RADIO DIRECTION-FINDING RADIO NAVIGATION SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	The embodiment of the disclosure relates to an electronic device, and a corresponding mounting process. A carrier substrate is configured to carry at least one electronic chip and includes a mounting front face. An encapsulating cover is mounted on the front face of the carrier substrate through a mounting. This mounting includes at least one seating surface through which the cover and the carrier substrate make contact. At least one adhesive bead is located elsewhere than the seating surface in order to securely fasten the encapsulation cover and the carrier substrate. 本公开的实施例涉及电子设备和对应的安装方法。承载衬底被配置为承载至少一个电子芯片，并且包括安装正面。封装盖件通过安装件而被安装在承载衬底的正面。该安装件包括至少一个座表面，盖件和承载衬底通过该座表面接触。至少一个粘合性珠被定位于不是座表面的位置，以便牢固地固定封装盖件和承载衬底。