Electronic component processing device

The present invention simplifies an electronic component processing device for adjusting the position of an electronic component with a bump. An electronic component processing device according to one aspect of the present disclosure is provided with: a first adsorption unit that adsorbs a first sur...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	MINAMI HIDEO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!