Electronic component processing device

The present invention simplifies an electronic component processing device for adjusting the position of an electronic component with a bump. An electronic component processing device according to one aspect of the present disclosure is provided with: a first adsorption unit that adsorbs a first surface of an electronic component having a first surface and a second surface facing opposite each other and having a bump on the second surface; a second adsorption unit which faces the first adsorption unit across the electronic component and adsorbs the second surface; and a position adjusting unit which is arranged on the second adsorption unit and is used for adjusting the position of the electronic component by being embedded with the bump. 本发明简化了进行带凸块的电子零部件的位置调节的电子零部件处理装置。本公开的一个方面的电子零部件处理装置具备：第一吸附部，吸附具有彼此朝向相反的第一面和第二面并在第二面上设有凸块的电子零部件的第一面；第二吸附部，隔着电子零部件与第一吸附部对置，吸附第二面；以及位置调节部，设于第二吸附部，通过与凸块嵌合来调节电子零部件的位置。