FILM FORMING APPARATUS AND METHOD FOR CONTROLLING FILM FORMING APPARATUS
The invention relates to a film forming apparatus and a control method of the film forming apparatus. Efficient operation of a film forming apparatus is achieved by shortening the time when a substrate is separated from a substrate adsorption member (electrostatic chuck). The film forming apparatus...
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| creator | AONUMA DAISUKE SUGAWARA HIROKI |
| description | The invention relates to a film forming apparatus and a control method of the film forming apparatus. Efficient operation of a film forming apparatus is achieved by shortening the time when a substrate is separated from a substrate adsorption member (electrostatic chuck). The film forming apparatus for forming a film on a film forming surface of the substrate via a mask is characterized by comprising: a substrate support unit for supporting the film forming surface side of the substrate; a substrate adsorption member having an adsorption surface that adsorbs a non-film-forming surface on the opposite side of the film-forming surface of the substrate; a mask suction member that is disposed on the opposite side of the mask with the substrate suction member therebetween and that pulls the mask toward the film formation surface; and a pressing part which is provided on the mask suction member and extends toward the substrate adsorption member in a direction intersecting the non-film-formation surface, and which, |
| format | Patent |
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Efficient operation of a film forming apparatus is achieved by shortening the time when a substrate is separated from a substrate adsorption member (electrostatic chuck). The film forming apparatus for forming a film on a film forming surface of the substrate via a mask is characterized by comprising: a substrate support unit for supporting the film forming surface side of the substrate; a substrate adsorption member having an adsorption surface that adsorbs a non-film-forming surface on the opposite side of the film-forming surface of the substrate; a mask suction member that is disposed on the opposite side of the mask with the substrate suction member therebetween and that pulls the mask toward the film formation surface; and a pressing part which is provided on the mask suction member and extends toward the substrate adsorption member in a direction intersecting the non-film-formation surface, and which,</description><language>chi ; eng</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210511&DB=EPODOC&CC=CN&NR=112779503A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210511&DB=EPODOC&CC=CN&NR=112779503A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>AONUMA DAISUKE</creatorcontrib><creatorcontrib>SUGAWARA HIROKI</creatorcontrib><title>FILM FORMING APPARATUS AND METHOD FOR CONTROLLING FILM FORMING APPARATUS</title><description>The invention relates to a film forming apparatus and a control method of the film forming apparatus. Efficient operation of a film forming apparatus is achieved by shortening the time when a substrate is separated from a substrate adsorption member (electrostatic chuck). 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Efficient operation of a film forming apparatus is achieved by shortening the time when a substrate is separated from a substrate adsorption member (electrostatic chuck). The film forming apparatus for forming a film on a film forming surface of the substrate via a mask is characterized by comprising: a substrate support unit for supporting the film forming surface side of the substrate; a substrate adsorption member having an adsorption surface that adsorbs a non-film-forming surface on the opposite side of the film-forming surface of the substrate; a mask suction member that is disposed on the opposite side of the mask with the substrate suction member therebetween and that pulls the mask toward the film formation surface; and a pressing part which is provided on the mask suction member and extends toward the substrate adsorption member in a direction intersecting the non-film-formation surface, and which,</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | FILM FORMING APPARATUS AND METHOD FOR CONTROLLING FILM FORMING APPARATUS |
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